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Shenzhen Eta Electronic Equipment Co., Ltd.

Address: No. 3, 3rd Road, Yangyong Industrial Zone, Shapu 1 Village, Songgang Town, Baoan District, Shenzhen, China

Phone: 0755 27428080

Fax: 0755 27428090

Website: www.eta-ele.com

Sales line:   

Mr. Wang

138 2528 6023

sales@eta-ele.com Email: sales@eta-ele.com

product name: CSP Unpackaged Chip Reflow
Product number: CSP Unpackaged Chip Reflow
Product introduction:

ETA ETA LED reflow soldering machine, the first domestic CSP reflow soldering machine with no packaging LED process!

Detailed introduction

埃塔LED倒装回流焊,国内首家led倒装专用回流焊机,国内首家CSP无封装led工艺回流焊机! ETA ETA LED flip-chip reflow soldering, the first domestic LED flip-chip reflow soldering machine, the first domestic CSP unpackaged LED process reflow soldering machine!

Model: ETA-T8

LED 倒装芯片 What is LED flip chip

倒装芯片,是指无需焊线就可直接与陶瓷基板直接贴合芯片,我们称之为 DA 芯片 Directly Attached chip )。 LED flip chip refers to a chip that can be directly bonded to a ceramic substrate without bonding wires, which we call a DA chip ( Directly Attached chip ).

Today's flip-chips are different from earlier flip-chips where flip-chip transfer to a silicon or other material substrate still requires bonding wires; compared to traditional front-mounted chips, the traditional chip electrical connection to the substrate is via wire bonding. Face up and the electrical side of the flip-chip face down is equivalent to flipping a conventional wafer over.

Luminous Features of Flip Chip

In fact, flip-chips have been around for a long time, juxtaposed with vertical and horizontal structures, and their light-emitting characteristics are that the active layer faces downward, while the transparent sapphire layer is located above the active layer, and the light emitted by the active layer needs to pass through the sapphire lining. Before reaching the outside of the chip.

Advantages of flip chip

First, no need to sapphire heat dissipation, good heat dissipation performance. Flip-chip structure because the active layer is closer to the substrate, which shortens the heat flow path from the heat source to the substrate. Flip-chips have a lower thermal resistance. This characteristic makes the performance of the flip-chips from lighting to thermal stability decrease greatly small.

2. In terms of luminous performance, under high current driving, the luminous efficiency is higher. Flip-chips have superior current expansion performance and ohmic contact performance. Flip-chip chips generally have lower voltage drops than traditional, vertical-structure chips. This makes flip-chips very advantageous under high-current drive and exhibits higher light efficiency.

3. Under high-power conditions, flip-chips are more secure and reliable than full-chips. LED 器件中,尤其是大功率,带 Lens 的封装形式中(传统带保护壳的防流明结构除外),超过一半的死灯现象都与金线的损伤有关,倒装芯片可以成免金线封装,这是从源头降低了器件死灯的概率。 In LED devices, especially in high-power packages with Lens (except the traditional lumen-proof structure with a protective case), more than half of the dead lights are related to the damage of gold wires. Flip-chips can be gold-free. Package, which is to reduce the probability of device dead lights from the source.

Fourth, the size can be made smaller, reducing product maintenance costs, and optics are easier to match; at the same time, it also lays the foundation for subsequent packaging process development.

For flip-chip chips, which may be used for large-scale solder paste bonding in the future, there will be a certain cost advantage, which will change the current scene of horizontal structure chips.

埃塔倒装回流焊接炉 ETA eta flip reflow oven

Flip Reflow Manufacturer

倒装芯片回流焊 LED flip chip reflow

Flip Reflow

倒装回流焊 CSP flip-chip reflow

  • ETA's patented technology: Impact forced hot air circulation system with world-class temperature uniformity and heating efficiency.
  • All temperature zones are heated up and down, independent circulation and independent temperature control. ℃。 The temperature control accuracy of each temperature zone reaches ± 1 ℃.
  • Excellent temperature uniformity. 裸板板面横向温度偏差<±2℃。 The lateral temperature deviation of the bare PCB surface is <± 2 ° C.
  • The front and back circulating air return design is adopted to effectively prevent the influence of air flow in the temperature zone and temperature zone, which is conducive to strengthening the temperature control and ensuring that the components are uniformly heated.
  • The furnace is made of stainless steel, which is resistant to heat and corrosion and easy to clean.
  • The upper cover is opened by self-locking electric drive, no air source is required, self-locking when power is off, safe and reliable.
  • 氮气两用。 Air / nitrogen dual use. When using nitrogen, a specially designed ultra-low nitrogen consumption device requires lower nitrogen consumption and saves costs.
  • The central support device can be raised and lowered to facilitate the welding of double panels.
  • Well-designed flux filtering system, compact structure.
  • The imported high temperature motor is directly driven for heating, low noise, small vibration, and no displacement of components.
  • All heating elements and mesh belts are imported from the original, with guaranteed quality and reliable use.
  • 分钟。 The temperature rises quickly, and it only takes 20 minutes from room temperature to working temperature .
  • 实际温度与设定温度差小于20℃。 With fast and efficient thermal compensation performance, the difference between the actual temperature of the PCB in the soldering zone and the set temperature is less than 20 ° C.
  • Enhanced double-sided cooling zone to improve cooling effect.
  • With a chain automatic lubrication system, the transportation is stable and reliable, and the life of the chain and the guide rail can be extended.
  • Servo control is adopted for transportation, and the control accuracy can reach ± 2mm / min.
  • ,网带宽度达560mm,适宜高效率的生产。 The maximum guide rail width is 440mm and the mesh belt width is 560mm, which is suitable for high-efficiency production.
  • The compact structure of the whole machine saves space.
  • ”操作界面和人工智能软件控制,具有完善的在线温度测试、 The whole machine adopts "Windows 98 " operation interface and artificial intelligence software control, with complete online temperature test,

虚拟仿真。 Curve analysis, storage, recall function and Smart Para virtual simulation.

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